图4 不同处理0~20 cm土层夏玉米根系微观结构 A和B: 深松处理根系中柱、导管和髓腔; C和D: 免耕处理根系中柱、导管和髓腔; E和F: 深松处理根系皮层; G和H: 免耕处理根系皮层。a: 导管; b: 髓腔; c: 中柱; d: 皮层。A、C、E和G为2012年数据; B、D、F和H为2013年数据。 Fig. 4 Root microstructure of summer maize root grown in 0-20 cm soil layer under different treatments A and B: stele, vessel and pulp cavity of sub-soiling treatment; C and D: stele, vessel and pulp cavity of no-tillage treatment; E and F: root cortex of sub-soiling treatment; G and H: root cortex of no-tillage treatment. a: stele; b: pulp cavity; c: vessel; d: cortex. A, C, E, and G: data in 2012; B, D, F, and H: data in 2013. |